A diode carrier arrangement for an electric machine is disclosed. The diode carrier arrangement includes diodes, a rail arrangement including metal rails, a metal plate, and an enclosure. The enclosure and a first metal rail delimit a first diode receptacle for receiving a diode, and the enclosure and the metal plate delimit a second diode receptacle for receiving a diode. The diodes are clamped in the respective diode receptacles via the enclosure onto the first metal rail and the metal plate.