发明公开
- 专利标题: ELECTRODE SUBSTRATE
-
申请号: US18678044申请日: 2024-05-30
-
公开(公告)号: US20240328985A1公开(公告)日: 2024-10-03
- 发明人: Naruto MIYAKAWA , Ayumi SHINAGAWA , Tomomi NAKANO , Shota USHIBA , Shinsuke TANI
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Nagaokakyo-shi
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Nagaokakyo-shi
- 优先权: JP 21196855 2021.12.03
- 主分类号: G01N27/30
- IPC分类号: G01N27/30 ; G01N27/327 ; H01B1/02 ; H01B5/16
摘要:
An electrode substrate includes an insulation substrate and a reference electrode on the insulation substrate. The reference electrode includes a silver layer, a first silver chloride layer, and a second silver chloride layer. The silver layer is on the insulation substrate. The first silver chloride layer is on the silver layer on the insulation substrate, and covers the silver layer. The second silver chloride layer is on the first silver chloride layer on the insulation substrate, and covers the first silver chloride layer. An area void fraction of the first silver chloride layer is larger than an area void fraction of the second silver chloride layer in any longitudinal section.
信息查询