Invention Publication
- Patent Title: ELECTRONIC DEVICES COMPRISING SILICON CARBIDE MATERIALS
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Application No.: US18743882Application Date: 2024-06-14
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Publication No.: US20240332002A1Publication Date: 2024-10-03
- Inventor: Santanu Sarkar , Farrell M. Good
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- The original application number of the division: US16751049 2020.01.23
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C01B32/00 ; C01B33/00 ; C23C16/04 ; C23C16/452

Abstract:
An electronic device comprising a stack structure comprising one or more stacks of materials and one or more silicon carbide materials adjacent to the one or more stacks of materials. The materials of the one or more stacks comprise a single chalcogenide material and one or more of a conductive carbon material, a conductive material, and a hardmask material. The one or more silicon carbide materials comprises silicon carbide, silicon carboxide, silicon carbonitride, silicon carboxynitride, and also comprise silicon-carbon covalent bonds. The one or more silicon carbide materials is configured as a liner or as a seal. Additional electronic devices are disclosed, as are related systems and methods of forming an electronic device.
Information query
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