• 专利标题: SERIALIZED LIQUID COOLING ARRANGEMENTS FOR DATACENTER SERVER RACKS
  • 申请号: US18617792
    申请日: 2024-03-27
  • 公开(公告)号: US20240334648A1
    公开(公告)日: 2024-10-03
  • 发明人: Hadrien BAUDUINMohamad HNAYNOMahdi VAHIDI FERDOUSIAli CHEHADE
  • 申请人: OVH
  • 申请人地址: FR Roubaix
  • 专利权人: OVH
  • 当前专利权人: OVH
  • 当前专利权人地址: FR Roubaix
  • 优先权: EP 305473.3 2023.03.31
  • 主分类号: H05K7/20
  • IPC分类号: H05K7/20
SERIALIZED LIQUID COOLING ARRANGEMENTS FOR DATACENTER SERVER RACKS
摘要:
A liquid cooling arrangement for cooling heat-generating components of a datacenter server rack. The cooling arrangement includes a liquid cooling loop configured to convey a cooling liquid, a plurality of server clusters each server cluster having a plurality of server assemblies that incorporate at least one respective liquid cooling unit, and a plurality of heat exchangers fluidly connected to the liquid cooling units of the plurality of server clusters via the liquid cooling loop. The heat exchangers configured to receive the heated cooling liquid discharged from the respective liquid cooling units and cool the received heated cooling liquid along with a pump fluidly coupled to the plurality of heat exchangers via the liquid cooling loop, wherein at least a portion of the liquid cooling loop comprises a serialized configuration that serially couples the server clusters and/or serially couples the server clusters and the heat exchangers.
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