A circuit board according to an embodiment includes an insulating layer; a first circuit pattern layer disposed on the insulating layer; a first protective layer disposed on the first circuit pattern layer and having a width narrower than of a width of the insulating layer; a second circuit pattern layer disposed under the insulating layer; and a second protective layer disposed under the second circuit pattern layer and having a width narrower than the width of the insulating layer, wherein a first surface of the insulating layer includes a first region overlapping the first protective layer in a vertical direction, and a second region excluding the first region, wherein a second surface opposite to the first surface of the insulating layer includes a third region overlapping the second protective layer in the vertical direction, and a fourth region excluding the third region, and wherein a portion of the second region overlaps a portion of the fourth region in the vertical direction.