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    CAMERA MODULE
    1.
    发明公开
    CAMERA MODULE 审中-公开

    公开(公告)号：US20230309235A1

    公开(公告)日：2023-09-28

    申请号：US18021974

    申请日：2021-08-17

    申请人： LG INNOTEK CO., LTD.

    发明人： Suk Ho KIM ,  Sang Hyuck NAM ,  Seok Jun HONG

    IPC分类号： H05K1/18 ,  H04N25/77 ,  H04N25/20

    CPC分类号： H05K1/182 ,  H04N25/77 ,  H04N25/20 ,  G02B5/208

    摘要： A camera module according to an embodiment includes a printed circuit board; an infrared filter disposed on an upper surface of the printed circuit board; and an image sensor disposed under a lower surface of the printed circuit board, wherein the printed circuit board includes: an insulating layer including a cavity overlapping at least a part of the infrared filter and at least a part of the image sensor in an optical axis direction; and a circuit pattern buried in the insulating layer and connected to a terminal of the image sensor; and wherein a shape of the cavity is different from a shape of the image sensor.

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
    2.
    发明公开
    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME 审中-公开

    公开(公告)号：US20240258223A1

    公开(公告)日：2024-08-01

    申请号：US18293165

    申请日：2022-07-29

    申请人： LG INNOTEK CO., LTD.

    发明人： Myung Jae KWON ,  Sang Hyuck NAM ,  Ki Su YEO

    IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00

    CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16227

    摘要： A circuit board according to an embodiment includes a first insulating layer including an upper and lower surface; a first through electrode passing through the upper and lower surfaces of the first insulating layer; and a first circuit pattern layer disposed on a lower surface of the first insulating layer, wherein the first through electrode includes: a first electrode part disposed adjacent to the lower surface of the first insulating layer and having a first inclination; and a second electrode part disposed adjacent to the upper surface of the first insulating layer and having a second inclination that is different from the first inclination so that a width gradually decreases toward the first upper surface of the first insulating layer, and wherein the first electrode part non-overlaps in a horizontal direction with the first circuit pattern layer.

    CIRCUIT BOARD
    3.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20230217592A1

    公开(公告)日：2023-07-06

    申请号：US17926294

    申请日：2021-05-21

    申请人： LG INNOTEK CO., LTD.

    发明人： Dong Sun KIM ,  Sang Hyuck NAM ,  Sung Wuk RYU

    IPC分类号： H05K1/11 ,  H05K1/03

    CPC分类号： H05K1/115 ,  H05K1/0366 ,  H05K2201/09827 ,  H05K2201/09854

    摘要： A circuit board according to an embodiment includes an insulating layer including an upper surface and a lower surface, and having a via hole passing through the upper surface and the lower surface in a thickness direction from the upper surface to the lower surface, wherein the via hole includes: a first via part adjacent to the upper surface and having a constant inclination angle along the thickness direction; a second via part adjacent to the lower surface and having a constant inclination angle along the vertical direction; and a third via part disposed between the first via part and the second via part and having an inclination angle different from an inclination angle of the first via part and an inclination angle of the second via part.

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
    4.
    发明公开
    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME 审中-公开

    公开(公告)号：US20240339413A1

    公开(公告)日：2024-10-10

    申请号：US18294320

    申请日：2022-08-02

    申请人： LG INNOTEK CO., LTD.

    发明人： Myung Jae KWON ,  Sang Hyuck NAM ,  Sang Hyun LEE

    IPC分类号： H01L23/538 ,  H05K1/02

    CPC分类号： H01L23/5386 ,  H05K1/0296 ,  H01L23/5385

    摘要： A circuit board according to an embodiment includes an insulating layer; a first circuit pattern layer disposed on the insulating layer; a first protective layer disposed on the first circuit pattern layer and having a width narrower than of a width of the insulating layer; a second circuit pattern layer disposed under the insulating layer; and a second protective layer disposed under the second circuit pattern layer and having a width narrower than the width of the insulating layer, wherein a first surface of the insulating layer includes a first region overlapping the first protective layer in a vertical direction, and a second region excluding the first region, wherein a second surface opposite to the first surface of the insulating layer includes a third region overlapping the second protective layer in the vertical direction, and a fourth region excluding the third region, and wherein a portion of the second region overlaps a portion of the fourth region in the vertical direction.

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
    7.
    发明公开
    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME 审中-公开

    公开(公告)号：US20240349419A1

    公开(公告)日：2024-10-17

    申请号：US18293695

    申请日：2022-07-29

    申请人： LG INNOTEK CO., LTD.

    发明人： Myung Jae KWON ,  Sang Hyuck NAM ,  Sang Hyun LEE

    IPC分类号： H05K1/02 ,  H05K1/11

    CPC分类号： H05K1/0271 ,  H05K1/111

    摘要： A circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and having a width narrower than that of the first insulating layer; wherein an upper surface of the first insulating layer includes a first region vertically overlapping with the second insulating layer, and a second region excluding the first region, wherein the first circuit pattern includes an extension portion extending from the first region to the second region; and wherein a width of the extension portion in the second region is greater than a width of at least a part of the extension portion in the first region.

    SEMICONDUCTOR PACKAGE
    8.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20230232544A1

    公开(公告)日：2023-07-20

    申请号：US18098578

    申请日：2023-01-18

    申请人： LG INNOTEK CO., LTD.

    发明人： Myung Jae KWON ,  Sang Hyuck NAM ,  Jin Hyoung PARK

    IPC分类号： H05K3/46 ,  H05K3/42 ,  H05K1/11

    CPC分类号： H05K3/4644 ,  H05K3/427 ,  H05K1/115 ,  H05K2201/0959

    摘要： A semiconductor package according to an embodiment includes a first insulating layer including a through hole; an insulating member disposed in the through hole of the first insulating layer; a first electrode layer disposed on the insulating member; a second insulating layer disposed on the first electrode layer; and a first through electrode passing through the second insulating layer, wherein the first through electrode overlaps the first electrode layer and the insulating member in a vertical direction.