Invention Publication
- Patent Title: COMPOSITE SUBSTRATES, SEMICONDUCTOR STRUCTURES, AND METHODS FOR MANUFACTURING COMPOSITE SUBSTRATES
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Application No.: US18634480Application Date: 2024-04-12
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Publication No.: US20240347601A1Publication Date: 2024-10-17
- Inventor: Kai CHENG
- Applicant: ENKRIS SEMICONDUCTOR, INC.
- Applicant Address: CN Suzhou
- Assignee: ENKRIS SEMICONDUCTOR, INC.
- Current Assignee: ENKRIS SEMICONDUCTOR, INC.
- Current Assignee Address: CN Suzhou
- Priority: CN 2310411773.8 2023.04.17
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L21/02 ; H01L29/04

Abstract:
The present disclosure provides a composite substrate including: a support layer; and a SiC monocrystalline layer on the support layer, where the SiC monocrystalline layer includes a first superjunction structure that includes first P-type layers and first N-type layers, and the first P-type layers and the first N-type layers extend inward along a thickness direction of the SiC monocrystalline layer from a surface of the SiC monocrystalline layer far from the support layer, and are alternately distributed in a direction parallel to a plane of the SiC monocrystalline layer.
Information query
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