发明公开
- 专利标题: ANTENNA STRUCTURE ON PACKAGE
-
申请号: US18137391申请日: 2023-04-20
-
公开(公告)号: US20240356197A1公开(公告)日: 2024-10-24
- 发明人: Yuanhao YU , Weifan WU , Yong-Chang SYU , Chung Ju YU
- 申请人: Advanced Semiconductor Engineering, Inc.
- 申请人地址: TW Kaohsiung
- 专利权人: Advanced Semiconductor Engineering, Inc.
- 当前专利权人: Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址: TW Kaohsiung
- 主分类号: H01Q1/22
- IPC分类号: H01Q1/22 ; H01L23/498 ; H01Q9/04 ; H01Q21/00
摘要:
The present disclosure provides an electronic device, which includes an encapsulant, an electronic component, an antenna structure, and a first conductive element. The electronic component is disposed in the encapsulant. The antenna structure has an antenna pattern exposed to air and facing the encapsulant, and a first supporting element separating the antenna pattern from the encapsulant. At least a portion of the first conductive element is within the encapsulant, and electrically connects the antenna pattern to the electronic component by the first supporting element.
信息查询