公开(公告)号：US20250046981A1

公开(公告)日：2025-02-06

申请号：US18228616

申请日：2023-07-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Weifan WU ,  Yong-Chang SYU

IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q21/00

Abstract: The present disclosure provides an electronic device. The electronic device includes a circuit structure, an interconnection structure disposed over the circuit structure, and an antenna element disposed over the interconnection structure. The antenna element defines a first recess having a sidewall, and the sidewall of the first recess of the antenna element is configured to feed a signal to the antenna element and is electrically connected to the interconnection structure.

公开(公告)号：US20240356197A1

公开(公告)日：2024-10-24

申请号：US18137391

申请日：2023-04-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Weifan WU ,  Yong-Chang SYU ,  Chung Ju YU

IPC: H01Q1/22 ,  H01L23/498 ,  H01Q9/04 ,  H01Q21/00

CPC classification number: H01Q1/2283 ,  H01L23/49811 ,  H01Q9/0407 ,  H01Q21/00 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01Q9/0421

Abstract: The present disclosure provides an electronic device, which includes an encapsulant, an electronic component, an antenna structure, and a first conductive element. The electronic component is disposed in the encapsulant. The antenna structure has an antenna pattern exposed to air and facing the encapsulant, and a first supporting element separating the antenna pattern from the encapsulant. At least a portion of the first conductive element is within the encapsulant, and electrically connects the antenna pattern to the electronic component by the first supporting element.