The present disclosure provides a thermosetting resin composition which can give a cured product having high toughness and in which the resin particles are unlikely to absorb moisture, and the like. The present disclosure relates to a thermosetting resin composition containing a thermosetting resin and resin particles, in which the resin particles contain a polyamide resin and a polyolefin resin, and the content of the polyamide resin in the resin particles is 50% by weight or more, and the like.