A semiconductor package and a method for making the same are provided. The semiconductor package may include: a substrate having a first surface and a second surface opposite to the first surface; a first insulating layer disposed on the first surface of the substrate and having a first concave portion; a first semiconductor interposer disposed in the first concave portion of the first insulating layer, the first semiconductor interposer including a first semiconductor layer and a plurality of first wiring patterns formed on the first semiconductor layer; a first electronic component overlapping with a first portion of the first semiconductor interposer and electrically connected with the first wiring patterns of the first semiconductor interposer; and a second electronic component overlapping with a second portion of the first semiconductor interposer and electrically connected with the first wiring patterns of the first semiconductor interposer.