• Patent Title: Stent With Enhanced Deployment Characteristics
  • Application No.: US18292777
    Application Date: 2022-07-29
  • Publication No.: US20240374405A1
    Publication Date: 2024-11-14
  • Inventor: Hussain Rangwala
  • Applicant: MicroVention, Inc.
  • Applicant Address: US CA Aliso Viejo
  • Assignee: MicroVention, Inc.
  • Current Assignee: MicroVention, Inc.
  • Current Assignee Address: US CA Aliso Viejo
  • International Application: PCT/US2022/074299 WO 20220729
  • Main IPC: A61F2/915
  • IPC: A61F2/915
Stent With Enhanced Deployment Characteristics
Abstract:
A stent with enhanced deployment characteristics to prevent twisting of the stent during delivery or deployment. The stent may include a first wire segment and a second wire segment that are linked together by at least one connector. The first wire segment may be rotatably connected to a first side of the at least one connector and the second wire segment may be rotatably connected to a second side of the at least one connector. The at least one connector may include an elongated body having at least two passages including a first passage for receiving the first wire segment and a second passage for receiving the second wire segment. The first and/or second wire segments may include enlargements to prevent the wire segments from being pulled out of the passages.
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