Invention Application
- Patent Title: HEAT PUMP SYSTEM FOR VEHICLE
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Application No.: US18464548Application Date: 2023-09-11
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Publication No.: US20240375481A1Publication Date: 2024-11-14
- Inventor: Hoyoung Jeong , Hochan An , Yeonho Kim , Jeawan Kim , Man Hee Park , Jae Yeon Kim , Yeong Jun Kim , Hae Jun Lee , Seong Hun Kim , Beom Seok Joo , Yun Jin Kim
- Applicant: Hyundai Motor Company , Kia Corporation , Hanon Systems
- Applicant Address: KR Seoul; KR Seoul; KR Daejeon
- Assignee: Hyundai Motor Company,Kia Corporation,Hanon Systems
- Current Assignee: Hyundai Motor Company,Kia Corporation,Hanon Systems
- Current Assignee Address: KR Seoul; KR Seoul; KR Daejeon
- Priority: KR10-2023-0059298 20230508
- Main IPC: B60H1/00
- IPC: B60H1/00

Abstract:
An embodiment heat pump system for a vehicle includes an air conditioner unit and a chiller. The air conditioner unit includes a compressor, first through third heat-exchangers, a first expansion valve, and an evaporator interconnected by a refrigerant line for circulating a refrigerant through the refrigerant line, and the chiller is connected to the refrigerant line through a first connection line for adjusting a temperature of a coolant by heat-exchanging the refrigerant with the coolant. The air conditioner unit further includes a second expansion valve on the first connection line upstream of the chiller, a first valve on the refrigerant line between the first and second heat-exchangers, a third expansion valve on the refrigerant line between the first valve and the second heat-exchanger, a second valve on the refrigerant line between the evaporator and the compressor, and a fourth expansion valve on a second connection line.
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