Invention Application
- Patent Title: 3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN REGIONS VERTICALLY ISOLATED FROM EACH OTHER BY STRENGTHENED ISOLATION STRUCTURE
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Application No.: US18239552Application Date: 2023-08-29
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Publication No.: US20240379780A1Publication Date: 2024-11-14
- Inventor: Keumseok PARK , Kang-ill SEO
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L21/8234 ; H01L27/06 ; H01L27/088 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/775 ; H01L29/786

Abstract:
Provided is a semiconductor device whch includes: a 1st source/drain region connected to a 1st channel structure; a 2nd source/drain region, above the 1st source/drain region, connected to a 2nd channel structure above the 1st channel structure; a channel isolation layer between the 1st channel structure and the 2nd channel structure; a source/drain isolation layer between the 1st source/drain region and the 2nd source/drain region; and a blocking structure between the channel isolation layer and the source/drain isolation layer, wherein an entire width of the blocking structure in a channel-length direction is verically below a lateral edge portion of the 2nd source/drain region.
Information query
IPC分类: