A composition configured for removing edge beads from metal-containing resists and/or as a developer composition of metal-containing resists is water-free and includes an organic solvent and at least one additive selected from among an amino acid-based compound, a sulfur-containing acid compound, and a sulfur-containing amine-based compound. A method of forming patterns using the composition includes coating a metal-containing resist composition on a substrate; coating the composition configured for removing edge beads from metal-containing resists of the present embodiments along edges of the substrate; drying and heating to form a metal-containing resist film on the substrate; exposing the metal-containing photoresist film; and developing the metal-containing resist film with the developer composition of metal-containing resists.