Invention Application
- Patent Title: METHOD FOR HEAT DISSIPATION OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE OF SAME
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Application No.: US18670135Application Date: 2024-05-21
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Publication No.: US20240393846A1Publication Date: 2024-11-28
- Inventor: Sangheon KIM , Kwangtaek WOO , Jiwoo LEE , Yonggil HAN
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2023-0066819 20230524,KR10-2023-0086677 20230704
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H04M1/02

Abstract:
An electronic device according to an embodiment of the disclosure may include: two or more housings, a flexible display mounted to one or more housings among the two or more housings and configured to be expanded or reduced according to a sliding operation of one or more housings among the two or more housings, one or more sensors configured to acquire one or more pieces of temperature information from the electronic device, and at least one processor, comprising processing circuitry, operatively connected to the one or more sensors and the flexible display, wherein at least one processor, individually and/or collectively, is configured to: identify at least one of operation state information or one or more pieces of temperature information acquired from the electronic device, identify expanding state information of the flexible display, and control the electronic device to change a size of the flexible display by sliding the one or more housings based on at least one of the operation state information or the one or more pieces of temperature information.
Information query