Invention Application
- Patent Title: BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES
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Application No.: US18783555Application Date: 2024-07-25
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Publication No.: US20240395769A1Publication Date: 2024-11-28
- Inventor: Chen-Hua Yu , Kuo Lung Pan , Shu-Rong Chun , Chi-Hui Lai , Tin-Hao Kuo , Hao-Yi Tsai , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L23/31 ; H01L23/367 ; H01L23/498 ; H01L23/64 ; H01L25/00 ; H01L25/065
Abstract:
A package includes a package substrate, an interposer over and bonded to the package substrate, a first wafer over and bonding to the interposer, and a second wafer over and bonding to the first wafer. The first wafer has independent passive device dies therein. The second wafer has active device dies therein.
Information query
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