Invention Application
- Patent Title: SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND SUBSTRATE DICING METHOD
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Application No.: US18392481Application Date: 2023-12-21
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Publication No.: US20240421000A1Publication Date: 2024-12-19
- Inventor: YANGGYOO JUNG , YOUNG LYONG KIM , SUNGWOO PARK
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2023-0076851 20230615
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L23/00
Abstract:
A semiconductor die includes: a first surface; a second surface opposite to the first surface; and a first side surface, a second side surface, a third side surface, and a fourth side surface between the first surface and the second surface, in which the first side surface faces the third side surface, and a roughness of the second side surface varies according to area, and a roughness of at least a portion of the second side surface is greater than that of the first side surface.
Information query
IPC分类:
