An electronic device is provided. The electronic device includes an electronic component, an encapsulating layer, a circuit structure, a bonding element and a first auxiliary pad. The encapsulating layer surrounds the electronic component. The circuit structure is electrically connected to the electronic component. The circuit structure has a connection part. The bonding element overlaps with the connection part and is electrically connected to the electronic component. The first auxiliary pad is disposed in the circuit structure. In addition, the connection part is disposed between the first auxiliary pad and the bonding element, and the connection part overlaps with the first auxiliary pad. Moreover, the intrinsic stress of the first auxiliary pad is between +800 MPa and −1000 MPa.