公开(公告)号：US20240339392A1

公开(公告)日：2024-10-10

申请号：US18599624

申请日：2024-03-08

Applicant: InnoLux Corporation

Inventor： Chih-Hao CHANG ,  Te-Hsun LIN ,  Wen-Hsiang LIAO

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L24/20 ,  H01L24/16 ,  H01L24/19 ,  H01L2224/16227 ,  H01L2224/19 ,  H01L2224/211

Abstract: An electronic device includes a circuit structure including: a first insulation layer including a first opening; a second insulation layer disposed in the first opening and including a second opening; a conductive connection layer disposed in the second opening; and a first conductive layer and a second conductive layer respectively disposed on a surface and another surface of the first insulation layer. The first and the second conductive layer are electrically connected through the conductive connection layer, and the Young's modulus of the second insulation layer is less than the Young's modulus of the first insulation layer. In a cross-section of the electronic device, a center of the second opening and an outer surface of the second insulation layer are separated by a first distance X1, and a maximum width W of the second opening and the first distance X1 conform to the following formula:






1
.
5

⁢
W

≦

X
1

公开(公告)号：US20240170385A1

公开(公告)日：2024-05-23

申请号：US18145198

申请日：2022-12-22

Applicant: InnoLux Corporation

Inventor： Te-Hsun LIN ,  Wen-Hsiang LIAO ,  Mei-Yen CHEN ,  Ming-Hsien SHIH ,  Yung-Feng CHEN ,  Cheng-Chi WANG

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2924/15174

Abstract: A semiconductor package device is provided. The semiconductor package device includes a chip and a redistribution layer disposed on the chip and electrically connected to the chip. The redistribution layer includes a plurality of first metal lines and a plurality of second metal lines, wherein at least one of the second metal lines is disposed between two adjacent first metal lines. The included angle between the at least one of the second metal lines and the two adjacent first metal lines is greater than or equal to 0 degrees and less than or equal to 10 degrees. The first width of one of the two adjacent first metal lines is greater than the second width of the at least one of the second metal lines.

公开(公告)号：US20240429193A1

公开(公告)日：2024-12-26

申请号：US18668786

申请日：2024-05-20

Applicant: InnoLux Corporation

Inventor： Pei-Yin CHOU ,  Te-Hsun LIN ,  Wen-Hsiang LIAO

IPC: H01L23/00 ,  H01L23/31

Abstract: An electronic device is provided. The electronic device includes an electronic component, an encapsulating layer, a circuit structure, a bonding element and a first auxiliary pad. The encapsulating layer surrounds the electronic component. The circuit structure is electrically connected to the electronic component. The circuit structure has a connection part. The bonding element overlaps with the connection part and is electrically connected to the electronic component. The first auxiliary pad is disposed in the circuit structure. In addition, the connection part is disposed between the first auxiliary pad and the bonding element, and the connection part overlaps with the first auxiliary pad. Moreover, the intrinsic stress of the first auxiliary pad is between +800 MPa and −1000 MPa.

公开(公告)号：US20240332158A1

公开(公告)日：2024-10-03

申请号：US18598066

申请日：2024-03-07

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Yen-Fu LIU ,  Wen-Hsiang LIAO ,  Te-Hsun LIN ,  Ju-Li WANG ,  Dong-Yan YANG ,  Ming-Hsien SHIH ,  Cheng-Tse TSAI

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68345 ,  H01L2224/13105 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/92125

Abstract: An electronic device is provided. The electronic device includes a chip, a redistribution structure, a contact pad, a buffer layer, and a first connection pad. The redistribution structure is electrically connected to the chip. The redistribution structure includes a metal pad, and the metal pad is disposed opposite to the chip. The contact pad is disposed on the metal pad. The buffer layer is disposed on the redistribution structure and includes an opening. The opening exposes at least a portion of the contact pad. The first connection pad is disposed on the contact pad and extends in the opening. Moreover, in a normal direction of the chip, the metal pad, the contact pad and the first connection pad overlap. A method of manufacturing an electronic device is also provided.

公开(公告)号：US20240421031A1

公开(公告)日：2024-12-19

申请号：US18661684

申请日：2024-05-12

Applicant: InnoLux Corporation

Inventor： Te-Hsun LIN ,  Wen-Hsuan CHANG ,  Wen-Hsiang LIAO

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/498 ,  H01L25/18

Abstract: An electronic device and a manufacturing method thereof are provided in the present disclosure. The electronic device includes a circuit structure, a plurality of electronic components and a structural unit. The circuit structure includes a plurality of conductive layers and at least one insulating layer. The plurality of conductive layers are electrically interconnected via a plurality of through holes in the at least one insulating layer. The plurality of electronic components are electrically connected to the circuit structure and are overlapped with the circuit structure. The structural unit is disposed adjacent to the plurality of electronic components. In a top view of the electronic device, at least a portion of the structural unit is disposed between adjacent two of the electronic components.

公开(公告)号：US20240153860A1

公开(公告)日：2024-05-09

申请号：US18069290

申请日：2022-12-21

Applicant: InnoLux Corporation

Inventor： Te-Hsun LIN ,  Wen-Hsiang LIAO ,  Yung-Feng CHEN ,  Ming-Hsien SHIH

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L23/49844 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H01L23/49833 ,  H01L2224/16013 ,  H01L2224/16105 ,  H01L2224/16227 ,  H01L2224/17104 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/182 ,  H01L2924/35121

Abstract: An electronic device is provided. The electronic device includes a redistribution structure, an electronic unit and a first conductive pad. The first conductive pad is disposed between the redistribution structure and the electronic unit. The electronic unit is electrically connected to the redistribution structure through the first conductive pad. The first conductive pad has a first coefficient of thermal expansion and a first Young's modulus. The first coefficient of thermal expansion and the first Young's modulus conform to the following formula: 0.7×(0.0069E2−1.1498E+59.661)≤CTE≤1.3×(0.0069E2−1.1498E+59.661), wherein CTE is the first coefficient of thermal expansion, and E is the first Young's modulus in the formula.

公开(公告)号：US20240145370A1

公开(公告)日：2024-05-02

申请号：US18083561

申请日：2022-12-18

Applicant: InnoLux Corporation

Inventor： Te-Hsun LIN ,  Wen-Hsiang LIAO ,  Ming-Hsien SHIH ,  Yung-Feng CHEN ,  Cheng-Chi WANG

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311

Abstract: A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.