Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
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Application No.: US18352833Application Date: 2023-07-14
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Publication No.: US20250022943A1Publication Date: 2025-01-16
- Inventor: Shih-Yen LIN , Po-Cheng TSAI , Che-Jia CHANG
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. , NATIONAL TAIWAN UNIVERSITY
- Applicant Address: TW Hsinchu; TW TAIPEI
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,NATIONAL TAIWAN UNIVERSITY
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,NATIONAL TAIWAN UNIVERSITY
- Current Assignee Address: TW Hsinchu; TW TAIPEI
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L21/02 ; H01L29/24 ; H01L29/66 ; H01L29/786

Abstract:
A semiconductor device includes a 2-D material channel layer, a gate structure, and source/drain electrodes. The gate structure is over a channel region of the 2-D material channel layer. The source/drain electrodes are over source/drain regions of the 2-D material channel layer, respectively. Each of the source/drain electrodes includes a 2-D material electrode and a metal electrode. The 2-D material electrode is below a bottom surface of a corresponding one of the source/drain regions of the 2-D material channel layer. The metal electrode is over a top surface of the corresponding one of the source/drain regions of the 2-D material channel layer.
Information query
IPC分类: