Invention Application
- Patent Title: LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
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Application No.: US18715221Application Date: 2022-08-22
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Publication No.: US20250025963A1Publication Date: 2025-01-23
- Inventor: Takeshi SAKAMOTO , Yo SUGIMOTO , Takafumi OGIWARA , Takashi KURITA , Ryo YOSHIMURA
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Priority: JP2022-009499 20220125
- International Application: PCT/JP2022/031623 WO 20220822
- Main IPC: B23K26/364
- IPC: B23K26/364

Abstract:
A laser processing device includes a support unit, a laser light source, a spatial light modulator, and a condensing unit. A modulation pattern displayed on a display unit of the spatial light modulator includes a branching pattern for branching laser light into first branched laser light components to form a first groove and second branched laser light components to form a second groove. A distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light adjacent to each other in a direction along the line is larger than a distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light in the width direction of the first groove and the second groove.
Information query
IPC分类: