A circuit board according to an embodiment includes a first insulating layer; a first circuit pattern layer disposed on the first insulating layer; and a second insulating layer disposed on the first circuit pattern layer and having a first cavity, wherein the first circuit pattern layer includes a first pad part vertically overlapping the first cavity; a second pad part that does not vertically overlap the first cavity; and a connection pattern part disposed between the first pad part and the second pad part, and the connection pattern part includes a first portion disposed inside the first cavity and connected to the first pad part, and a second portion disposed outside the first cavity and connected to the second pad part.