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    CIRCUIT BOARD
    2.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20230199944A1

    公开(公告)日：2023-06-22

    申请号：US17926681

    申请日：2021-05-21

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Dong Keon LEE ,  Jung Hoon PARK ,  Seok Jong YOUH

    IPC: H05K1/02 ,  H05K1/09

    CPC classification number: H05K1/0256 ,  H05K1/09

    Abstract: A circuit board according to an embodiment includes an insulating layer; a first circuit pattern disposed on a first surface of the insulating layer; a first solder resist disposed on the first surface of the insulating layer; and a first barrier layer including a first-first portion disposed between the first solder resist and the first circuit pattern, and a first-second portion disposed between the insulating layer and the first circuit pattern; wherein the firs-first portion of the first barrier layer includes: a first-first gold (Au) layer disposed under a lower surface of the first circuit pattern; and a first-first palladium (Pd) layer disposed under a lower surface of the first-first gold (Au) layer; wherein the first-second portion of the first barrier layer includes: a first-second gold (Au) layer disposed to surround a side surface and an upper surface of the first circuit pattern; and a first-second palladium (Pd) layer disposed to surround the first-second gold (Au) layer; and wherein the first circuit pattern is not in contact with the first solder resist and the insulating layer by the first-first portion and the first-second portion of the first barrier layer.

    TOUCH PANEL AND DISPLAY
    4.
    发明申请
    TOUCH PANEL AND DISPLAY 有权
    触摸板和显示器

    公开(公告)号：US20150062060A1

    公开(公告)日：2015-03-05

    申请号：US14017972

    申请日：2013-09-04

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jong Sun KIM ,  Dong Keon LEE ,  Ja Ram KIM

    IPC: G06F3/041

    CPC classification number: G06F3/044 ,  G06F2203/04111

    Abstract: Provided are a touch panel and a display, the touch panel, including: a substrate; a connection part formed on the substrate; an insulating part thrilled on the connection part; a first electrode part electrically connected to the connection part; and a second electrode part insulated with the connection part.

    Abstract translation: 提供触摸面板和显示器，触摸面板，包括：基板; 形成在所述基板上的连接部; 在连接部分上激起绝缘部分; 电连接到所述连接部的第一电极部; 以及与所述连接部绝缘的第二电极部。

    CIRCUIT BOARD
    5.
    发明申请
    CIRCUIT BOARD 有权

    公开(公告)号：US20250098059A1

    公开(公告)日：2025-03-20

    申请号：US18967855

    申请日：2024-12-04

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Dong Keon LEE ,  Jung Hoon PARK ,  Seok Jong YOUH

    IPC: H05K1/02 ,  H05K1/09

    Abstract: A circuit board according to an embodiment includes an insulating layer; a first circuit pattern disposed on a first surface of the insulating layer; a first solder resist disposed on the first surface of the insulating layer; and a first barrier layer including a first-first portion disposed between the first solder resist and the first circuit pattern, and a first-second portion disposed between the insulating layer and the first circuit pattern; wherein the firs-first portion of the first barrier layer includes: a first-first gold (Au) layer disposed under a lower surface of the first circuit pattern; and a first-first palladium (Pd) layer disposed under a lower surface of the first-first gold (Au) layer; wherein the first-second portion of the first barrier layer includes: a first-second gold (Au) layer disposed to surround a side surface and an upper surface of the first circuit pattern; and a first-second palladium (Pd) layer disposed to surround the first-second gold (Au) layer; and wherein the first circuit pattern is not in contact with the first solder resist and the insulating layer by the first-first portion and the first-second portion of the first barrier layer.

    TOUCH WINDOW
    6.
    发明申请
    TOUCH WINDOW 审中-公开

    公开(公告)号：US20180101258A1

    公开(公告)日：2018-04-12

    申请号：US15568352

    申请日：2016-04-08

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sung Oh CHO ,  Seong Il KWEON ,  Dong Keon LEE ,  Wong Sic KIM ,  Ja Ram KIM ,  Dong Mug SEONG ,  Suk Yong LEE

    IPC: G06F3/044 ,  G06F3/047

    CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F3/047 ,  G06F2203/04112

    Abstract: A touch window according to an embodiment comprises: a substrate; a sensing electrode arranged on the substrate; and a reflection prevention layer arranged on the sensing electrode, wherein the reflection prevention layer comprises a first sub reflection prevention layer arranged on a first surface of the sensing electrode, a third sub reflection prevention layer arranged on a second surface, which lies opposite the first surface, and second sub reflection prevention layers arranged on both side surfaces, which connect the first and second surfaces, respectively. In addition, a touch window according to an embodiment comprises: a substrate; a base member comprising a pattern portion arranged on the substrate; a sensing electrode arranged inside the pattern portion; and a reflection prevention layer surrounding the sensing electrode, wherein the reflection prevention layer comprises a first sub reflection prevention layer arranged on the lower surface of the sensing electrode, second sub reflection prevention layers arranged on both side surfaces of the sensing electrode, and a third sub reflection prevention layer arranged on the upper surface of the sensing electrode, and the second sub reflection prevention layers comprise inclined surfaces, respectively. In addition, a touch window according to an embodiment comprises: a substrate; a sensing electrode on the substrate; a first sub reflection prevention layer arranged on a first surface of the sensing electrode; and a third sub reflection prevention layer arranged on a second surface of the sensing electrode, wherein at least one of the sensing electrode, the first sub reflection prevention layer, and the third sub reflection prevention layer has a side surface inclined at an acute angle of inclination with regard to a surface of the substrate.

    FINGERPRINT IDENTIFICATION SYSTEM FOR VEHICLE AND VEHICLE SMART KEY INCLUDING THE SAME
    7.
    发明申请
    FINGERPRINT IDENTIFICATION SYSTEM FOR VEHICLE AND VEHICLE SMART KEY INCLUDING THE SAME 审中-公开
    用于车辆和车辆的指纹识别系统包括其中的智能钥匙

    公开(公告)号：US20150248799A1

    公开(公告)日：2015-09-03

    申请号：US14624230

    申请日：2015-02-17

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Dong Keon LEE ,  Dong Mug SEONG ,  Chung Wan LEE ,  Jae Hak HER

    IPC: G07C9/00

    CPC classification number: G07C9/00174 ,  B60R25/252 ,  G07C9/00563 ,  G07C2009/00769 ,  G07C2209/65

    Abstract: A fingerprint identification system including a starting button unit including a starting touch panel to extract a fingerprint of a user, a door handle including a door touch panel to extract the fingerprint of the user; and a control unit to control starting of a vehicle by comparing the extracted fingerprint of the user with a fingerprint, which is previously stored, and to generate an alarm signal. The starting touch panel is provided on a starting button unit.

    Abstract translation: 一种指纹识别系统，包括：起动按钮单元，其包括用于提取用户指纹的起始触摸面板;门把手，其包括门触摸面板以提取用户的指纹; 以及控制单元，通过将所提取的用户的指纹与预先存储的指纹进行比较来控制车辆的起动，并产生报警信号。 启动触摸面板设置在启动按钮单元上。

    CIRCUIT BOARD
    8.
    发明申请
    CIRCUIT BOARD 有权

    公开(公告)号：US20250031303A1

    公开(公告)日：2025-01-23

    申请号：US18714498

    申请日：2022-11-29

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Dong Keon LEE ,  Seok Jong YOUH

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

    Abstract: A circuit board according to an embodiment includes a first insulating layer; a first circuit pattern layer disposed on the first insulating layer; and a second insulating layer disposed on the first circuit pattern layer and having a first cavity, wherein the first circuit pattern layer includes a first pad part vertically overlapping the first cavity; a second pad part that does not vertically overlap the first cavity; and a connection pattern part disposed between the first pad part and the second pad part, and the connection pattern part includes a first portion disposed inside the first cavity and connected to the first pad part, and a second portion disposed outside the first cavity and connected to the second pad part.

    SEMICONDUCTOR PACKAGE
    9.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20250029932A1

    公开(公告)日：2025-01-23

    申请号：US18716018

    申请日：2022-12-01

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yu Lim CHOE ,  Tae Gyu KANG ,  Dong Keon LEE

    IPC: H01L23/538 ,  H01L23/13 ,  H01L23/498

    Abstract: A semiconductor package according to an embodiment includes a first insulating layer including a cavity; a connection member buried in the cavity of the first insulating layer; and a molding layer buried in the cavity and surrounding the connection member, wherein a width of the molding layer gradually decreases along a direction from a lower surface of the first insulating layer to an upper surface of the first insulating layer.

    SEMICONDUCTOR PACKAGE
    10.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20240021524A1

    公开(公告)日：2024-01-18

    申请号：US18284028

    申请日：2022-03-25

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Tae Gyu KANG ,  Dong Keon LEE ,  Won Suk JUNG

    IPC: H01L23/538 ,  H01L25/065 ,  H10B80/00

    CPC classification number: H01L23/5383 ,  H01L25/0657 ,  H10B80/00 ,  H01L2225/06568 ,  H01L2225/06506 ,  H01L2225/0651

    Abstract: A semiconductor package according to an embodiment includes a first substrate layer; and a second substrate layer disposed on the first substrate layer, wherein the first substrate layer includes at least one first insulating layer; a first circuit pattern disposed on the first insulating layer; and a first via passing through the first insulating layer and connected to the first circuit pattern, wherein the second substrate layer includes a second insulating layer disposed on the first insulating layer; a second circuit pattern disposed on the second insulating layer; and a second via passing through the second insulating layer and connected to the second circuit pattern, wherein the first insulating layer and the second insulating layer include different insulating materials and wherein a width of the first via is different from a width of the second via.

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