Described herein are photopolymerizable compositions for use in 3D printing. The compositions contain highly crosslinkable acrylate monomers, oligomers comprising a polyether acrylate oligomer, a polyester oligomer, an unsaturated polyester oligomer, or a combination thereof and a photoinitiator. The compositions, after photopolymerization, have a high heat deflection temperature, while maintaining strong mechanical properties. Also described are methods for fabricating three dimensional objects utilizing these compositions, and three dimensional objects made from these compositions.