Invention Application
- Patent Title: DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT
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Application No.: US18761881Application Date: 2024-07-02
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Publication No.: US20250059095A1Publication Date: 2025-02-20
- Inventor: Toshihiro IGUCHI , Kenichiro MASUDA , Tetsuya YOSHIYAMA , Takuma ARIIZUMI , Toshio ASAHI
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2023-133537 20230818
- Main IPC: C04B35/468
- IPC: C04B35/468 ; H01G4/12 ; H01G4/30

Abstract:
A dielectric composition includes main phase grains and segregation grains. The segregation grains at least partly include Ba—Mg—Si—O segregation grains including Ba, Mg, Si, and O. Ba, Mg, and Si in the Ba—Mg—Si—O segregation grains constitute 70 parts by mol or more in total out of 100 parts by mol of a total of metal elements and Si in the Ba—Mg—Si—O segregation grains.
Information query
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