• Patent Title: THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC CIRCUIT BOARD HAVING THE THIN FILM CAPACITOR
  • Application No.: US18841735
    Application Date: 2023-01-26
  • Publication No.: US20250069814A1
    Publication Date: 2025-02-27
  • Inventor: Miyu HASEGAWADaiki ISHII
  • Applicant: TDK CORPORATION
  • Applicant Address: JP Tokyo
  • Assignee: TDK CORPORATION
  • Current Assignee: TDK CORPORATION
  • Current Assignee Address: JP Tokyo
  • International Application: PCT/JP2023/002467 WO 20230126
  • Main IPC: H01G4/33
  • IPC: H01G4/33 H01G2/06 H01G4/232
THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC CIRCUIT BOARD HAVING THE THIN FILM CAPACITOR
Abstract:
To provide a thin film capacitor having a large capacitance. A thin film capacitor includes a metal foil having roughened main surfaces, a dielectric film covering the main surfaces, an electrode layer contacting the metal foil through an opening formed in the dielectric film and having a surface formed as a metal terminal, an electrode layer contacting the dielectric film without contacting the metal foil and having a surface formed as a metal terminal, and an electrode layer contacting the dielectric film without contacting the metal foil. The electrode layers include a conductive polymer layer contacting the dielectric film.
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