Invention Application
- Patent Title: THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC CIRCUIT BOARD HAVING THE THIN FILM CAPACITOR
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Application No.: US18841735Application Date: 2023-01-26
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Publication No.: US20250069814A1Publication Date: 2025-02-27
- Inventor: Miyu HASEGAWA , Daiki ISHII
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- International Application: PCT/JP2023/002467 WO 20230126
- Main IPC: H01G4/33
- IPC: H01G4/33 ; H01G2/06 ; H01G4/232

Abstract:
To provide a thin film capacitor having a large capacitance. A thin film capacitor includes a metal foil having roughened main surfaces, a dielectric film covering the main surfaces, an electrode layer contacting the metal foil through an opening formed in the dielectric film and having a surface formed as a metal terminal, an electrode layer contacting the dielectric film without contacting the metal foil and having a surface formed as a metal terminal, and an electrode layer contacting the dielectric film without contacting the metal foil. The electrode layers include a conductive polymer layer contacting the dielectric film.
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