Invention Application
- Patent Title: ELECTRICAL COMPONENT AND METHOD OF FORMING SAME
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Application No.: US18725120Application Date: 2022-12-27
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Publication No.: US20250070009A1Publication Date: 2025-02-27
- Inventor: Caian Qiu , David A. Ruben , Neha M. Patel , Patrick W. Kinzie , Ramiro Garcia , Tom Hammann , Chris Bohn
- Applicant: MEDTRONIC, INC. , Samtec, Inc.
- Applicant Address: US MN Minneapolis; US IN New Albany
- Assignee: MEDTRONIC, INC.,Samtec, Inc.
- Current Assignee: MEDTRONIC, INC.,Samtec, Inc.
- Current Assignee Address: US MN Minneapolis; US IN New Albany
- International Application: PCT/US2022/054066 WO 20221227
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48
Abstract:
Various embodiments of an electrical component and a method of forming such electrical component are disclosed. The electrical component includes a substrate and one or more corrosion-resistant vias. The substrate includes ceramic or sapphire. Each of the one or more corrosion-resistant vias includes one or more sidewalls formed by the substrate a corrosion-resistant alloy bonded to the one or more sidewalls.
Information query
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