The present disclosure provides systems, methods, and devices for producing an interconnect. A method of manufacturing an electronic device includes forming a first circuit component at a first portion of a deformable substrate. The method further includes forming a second circuit component at a second portion of the deformable substrate. Additionally, the method includes electronically coupling the first circuit component and the second circuit component with a composition. The composition includes a first metal material further including a first weight percent (w %) of the composition. the first metal material is gallium indium alloy, gallium tin alloy, gallium indium tin alloy, gallium indium tin zinc alloy, or a combination thereof. The composition includes a filler material disposed within the first metal material. The filler material includes a second w % of the composition. Accordingly, the method forms an interconnect between the first circuit component and the second circuit component.