公开(公告)号：US20250113445A1

公开(公告)日：2025-04-03

申请号：US18479768

申请日：2023-10-02

Applicant: Meta Platforms Technologies, LLC

Inventor： Wenyang Pan ,  Zixuan Deng ,  Omar Awartani ,  Marcos Antonio Santana Andrade, JR. ,  Felippe Jose Pavinatto ,  Kristopher Erickson

IPC: H05K3/40 ,  H05K1/03

Abstract: The present disclosure provides systems, methods, and devices for producing an interconnect. A method of manufacturing an electronic device includes forming a first circuit component at a first portion of a deformable substrate. The method further includes forming a second circuit component at a second portion of the deformable substrate. Additionally, the method includes electronically coupling the first circuit component and the second circuit component with a composition. The composition includes a first metal material further including a first weight percent (w %) of the composition. the first metal material is gallium indium alloy, gallium tin alloy, gallium indium tin alloy, gallium indium tin zinc alloy, or a combination thereof. The composition includes a filler material disposed within the first metal material. The filler material includes a second w % of the composition. Accordingly, the method forms an interconnect between the first circuit component and the second circuit component.

公开(公告)号：US20250145844A1

公开(公告)日：2025-05-08

申请号：US18934489

申请日：2024-11-01

Applicant: Meta Platforms Technologies, LLC

Inventor： Wenyang Pan ,  Kristopher Erickson ,  Zixuan Deng ,  Zhenzhen Shen ,  Cameron Glasscock

IPC: C09D11/102 ,  C08K3/105 ,  C09D11/033

Abstract: Described herein are compositions and methods for wetting and adhering noble metal inks to silicone substrates. The metal ink-silicone interface is modified by functionalizing the surface of noble metal nanoparticles (NPs) or nanowires (NWs), and/or the surface of silicone substrates, with a small molecule binder for thiol-noble metal bonding.

公开(公告)号：US20240092987A1

公开(公告)日：2024-03-21

申请号：US18467201

申请日：2023-09-14

Applicant: Meta Platforms Technologies, LLC

Inventor： Li Yao ,  Wenyang Pan ,  Ziyan Liu ,  Shawn Reese ,  Thomas John Farrell Wallin ,  Zhenzhen Shen ,  Fang He ,  Robert Cole Bolger-Cruz ,  Sudhanshu Rathod ,  Kristopher Erickson

IPC: C08J9/00 ,  A61B5/268

CPC classification number: C08J9/0076 ,  A61B5/268 ,  C08K3/046 ,  C08K2201/001 ,  C08K2201/011

Abstract: Described herein are conductive elastomeric foam materials and methods of making and using the same. The conductive elastomeric foam materials include a polymeric matrix, one or more conductive fillers, and one or more foaming agents. The polymeric matrix can include a thermoset polymer or a thermoplastic polymer. Also described herein are methods of making conductive elastomeric foam materials. Further described herein are molded products including the conductive elastomeric foam materials as described herein and wearable devices including the molded products.

公开(公告)号：US20240132739A1

公开(公告)日：2024-04-25

申请号：US18479782

申请日：2023-10-02

Applicant: Meta Platforms Technologies, LLC

Inventor： Omar Awartani ,  Marcos Antonio Santana Andrade, JR. ,  Wenyang Pan ,  Kristopher Erickson ,  Thomas John Farrell Wallin

IPC: C09D11/54 ,  C22C28/00 ,  H05K1/02

CPC classification number: C09D11/54 ,  C22C28/00 ,  H05K1/028

Abstract: An optimized solvent-based liquid metal composition includes a solution and a liquid metal mixed with the solution. The solution includes at least one solvent and a polymeric binder dissolved in the at least one solvent. Additionally or optionally, the composition includes a metallic filler. The ingredients of the composition are tailored to extend decap time while maintaining other beneficial properties to permit the use of the composition in various printing techniques.

公开(公告)号：US20240120246A1

公开(公告)日：2024-04-11

申请号：US18479780

申请日：2023-10-02

Applicant: Meta Platforms Technologies, LLC

Inventor： Omar Awartani ,  Zhen Zheng ,  Marcos Antonio Santana Andrade, JR. ,  Kristopher Erickson ,  Alejandra Alvarez Albarran ,  Allison Tuuri

IPC: H01L23/29 ,  H01B1/22 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/298 ,  H01B1/22 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/49872

Abstract: An electronic device includes a substrate and a circuit having a plurality of electrically-conductive components disposed on the substrate. The plurality of electrically-conductive components includes first, second and third electrically-conductive components. The third electrically-conductive component has a first end portion forming a first interface with the first electrically-conductive component and a second end portion forming a second interface with the second electrically conductive component. The first electrically-conductive component is made of a first material including a first metal. The second electrically-conductive component is made of a second material including the first metal. The third electrically-conductive component is made of a third material including a gallium-based alloy and a metallic filler. The metallic filler reduces a reactivity of the third electrically-conductive component with the first metal at the first and second interfaces, and thus minimizes deterioration of the first electrically-conductive component and the second electrically-conductive component over time.