Invention Application
- Patent Title: LITHOGRAPHY APPARATUS
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Application No.: US18757567Application Date: 2024-06-28
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Publication No.: US20250123573A1Publication Date: 2025-04-17
- Inventor: Sung Yong BAE , Hyeon Jin KIM , Jeong-Gil KIM , Kyoung Hwan OH , Dong Jin LEE
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2023-0136658 20231013
- Main IPC: G03F7/00
- IPC: G03F7/00

Abstract:
A lithography apparatus comprises a wafer stage, a cable configured to be bent as the wafer stage moves, a first support configured to prevent the cable from sagging, and to support the cable to maintain a bent state of the cable when the cable moves, a first rail installed on a first side of the cable, and including curved track extending in a direction from a lower portion of the cable toward an upper portion of the cable, wherein the first rail includes a concave first surface, a second rail installed on a second side of the cable opposite the first side of the cable, and including curved track extending in the direction from the lower portion of the cable toward the upper portion of the cable, wherein the second rail includes a concave second surface.
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