LITHOGRAPHY APPARATUS
    1.
    发明申请

    公开(公告)号:US20250123573A1

    公开(公告)日:2025-04-17

    申请号:US18757567

    申请日:2024-06-28

    Abstract: A lithography apparatus comprises a wafer stage, a cable configured to be bent as the wafer stage moves, a first support configured to prevent the cable from sagging, and to support the cable to maintain a bent state of the cable when the cable moves, a first rail installed on a first side of the cable, and including curved track extending in a direction from a lower portion of the cable toward an upper portion of the cable, wherein the first rail includes a concave first surface, a second rail installed on a second side of the cable opposite the first side of the cable, and including curved track extending in the direction from the lower portion of the cable toward the upper portion of the cable, wherein the second rail includes a concave second surface.

    MONITORING SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MONITORING METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE USING THE SAME

    公开(公告)号:US20240272559A1

    公开(公告)日:2024-08-15

    申请号:US18455277

    申请日:2023-08-24

    CPC classification number: G03F7/70591 G03F7/70033 H01L22/12

    Abstract: A monitoring system for manufacturing a semiconductor device comprises a source module, an optical module including a collector collecting and reflecting extreme ultraviolet generated light from the source module, an illumination optical system including a field facet mirror, and a projection optical system transferring the extreme ultraviolet light reflected from a reticle to a substrate. A calculating module calculates a degradation rate of the optical module, and a method comprises respectively generating a reference image profile and an (N)th image profile through the second sensor module by correcting the far field image of the extreme ultraviolet with respect to the intensity of the extreme ultraviolet at a reference time point and an (N)th time point after the reference time point, and calculating the degradation rate of the optical module by using a ratio of the reference image profile and the (N)th image profile by the calculation module.

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