A chip structure including a semiconductor chip, a photonic integrated circuit chip spaced apart from the semiconductor chip in a horizontal direction, an electronic integrated circuit chip on the semiconductor chip and the photonic integrated circuit chip, a first molding layer surrounding the semiconductor chip and the photonic integrated circuit chip, and a second molding layer on the semiconductor chip, the photonic integrated circuit chip, and the first molding layer and surrounding the electronic integrated circuit chip. A portion of the electronic integrated circuit chip overlaps the photonic integrated circuit chip in a vertical direction, and another portion of the electronic integrated circuit chip overlaps the semiconductor chip in the vertical direction.