Invention Application
- Patent Title: FINGERPRINT SENSOR PACKAGE AND SMART CARD INCLUDING THE SAME
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Application No.: US18937240Application Date: 2024-11-05
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Publication No.: US20250165093A1Publication Date: 2025-05-22
- Inventor: Yoonseok SEO , Yechung CHUNG
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2023-0161444 20231120
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/044 ; G06K19/07 ; G06V40/13
Abstract:
Provided is a fingerprint sensor package including an anisotropic conductive film including a conductive ball.
Information query
