公开(公告)号：US20250131230A1

公开(公告)日：2025-04-24

申请号：US18672381

申请日：2024-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yechung CHUNG ,  Woonbae KIM ,  Youngjun YOON ,  Soyoung LIM ,  Jaehyun LIM ,  Inho CHOI

IPC: G06K19/07 ,  G06K19/077 ,  G06V40/13

Abstract: A fingerprint sensor package carrier includes: a film member including through-holes formed in sides of the film member; and a plurality of fingerprint sensor packages arranged on the film member, wherein each of the plurality of fingerprint sensor packages includes a substrate and a controller chip disposed on the substrate, wherein the substrate of each of the plurality of fingerprint sensor packages includes a plurality of first sensing patterns and a plurality of second sensing patterns, wherein the plurality of first sensing patterns are spaced apart from each other in a first direction and extend in a second direction intersecting the first direction, and the plurality of second sensing patterns are spaced apart from each other in the second direction and extend in the first direction, and wherein the film member has adhesiveness, such that the plurality of fingerprint sensor packages are configured to be detached from the film member.

公开(公告)号：US20250165093A1

公开(公告)日：2025-05-22

申请号：US18937240

申请日：2024-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonseok SEO ,  Yechung CHUNG

IPC: G06F3/041 ,  G06F3/044 ,  G06K19/07 ,  G06V40/13

Abstract: Provided is a fingerprint sensor package including an anisotropic conductive film including a conductive ball.

公开(公告)号：US20240162213A1

公开(公告)日：2024-05-16

申请号：US18376467

申请日：2023-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yechung CHUNG ,  Woonbae KIM ,  Jeongkyu HA

IPC: H01L25/18 ,  H01L23/552 ,  H10K59/90

CPC classification number: H01L25/18 ,  H01L23/552 ,  H10K59/90 ,  H01L23/5387

Abstract: A display apparatus includes a silicon substrate including a first surface and a second surface opposite thereto and including an opaque material, a display panel disposed on the first surface of the silicon substrate, a base film including a third surface and a fourth surface opposite thereto, the fourth surface having a portion facing the first surface of the silicon substrate, a display driving chip mounted on the base film, a connector disposed on a portion of the third surface of the base film, and a driving printed circuit board (PCB) electrically connected with the base film, wherein the silicon substrate corresponds to the base film in a one-to-one relationship, and a length of an edge of the base film overlapping the silicon substrate is about 90% of a length of an edge of the silicon substrate parallel to the edge of the base film.

公开(公告)号：US20170372992A1

公开(公告)日：2017-12-28

申请号：US15465146

申请日：2017-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yechung CHUNG ,  Woonbae KIM ,  Soyoung LIM ,  Jeong-Kyu HA

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/09 ,  H01L2224/0912

Abstract: In an embodiment, the film product includes a film substrate having a first surface and a second surface opposite the first surface. The film substrate has a length in a first direction and a width in a second direction perpendicular to the first direction. A first plurality of pads is on one of the first surface and the second surface, and the first plurality of pads is arranged in a third direction, the third direction being diagonal with respect to at least one of the first direction and the second direction. At least one merge line is electrically connecting at least two of the first plurality of pads.

公开(公告)号：US20220173026A1

公开(公告)日：2022-06-02

申请号：US17340280

申请日：2021-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungsuk YANG ,  Soyoung LIM ,  Yechung CHUNG

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/66 ,  H01L23/538

Abstract: A package substrate film including a film substrate including upper and lower surfaces; a test pattern including an upper test line pattern extending on the upper surface of the film substrate; a lower test line pattern extending on the lower surface of the film substrate; a first test via pattern penetrating the film substrate and connecting the upper test line pattern to the lower test line pattern; a second test via pattern penetrating the film substrate outside the first test via pattern and connecting the upper test line pattern to the lower test line pattern; and a test pad between the first test via pattern and the second test via pattern, the test pad including first test pad at an outer side of the first test via pattern; and second test pad at an inner side of the second test via pattern and facing the first test pad.