Invention Grant
- Patent Title: Rapid fine-grained copper electrodeposition
- Patent Title (中): 快速细粒度铜电沉积
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Application No.: US5163948Application Date: 1948-09-28
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Publication No.: US2612469APublication Date: 1952-09-30
- Inventor: REISINGER FREDERICK F
- Applicant: WIRE COATING AND MFG COMPANY
- Assignee: Wire Coating and Manuf Co
- Current Assignee: Wire Coating and Manuf Co
- Priority: US5163948 1948-09-28
- Main IPC: C25D3/40
- IPC: C25D3/40
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