-
公开(公告)号：US20230215626A1
公开(公告)日：2023-07-06
申请号：US18119979
申请日：2023-03-10
Applicant: Enphase Energy, Inc.
Inventor： MICHAEL J. HARRISON
IPC: H01F41/098 , C25D7/06 , C25D3/40 , C25D1/00 , C25D17/00
CPC classification number: H01F41/098 , C25D7/0614 , C25D3/40 , C25D1/003 , C25D17/00
Abstract: Methods and apparatus for producing helix windings used for a transformer are provided. For example, apparatus comprise an electrically conductive mandrel comprising an elongated body, a head comprising an eyelet detail, and a winding structure disposed along the elongated body.
-
公开(公告)号：US10975485B2
公开(公告)日：2021-04-13
申请号：US16432857
申请日：2019-06-05
Applicant: Fabric8Labs, Inc.
Inventor： David Forrest Pain , David Morgan Wirth , Jeffrey William Herman
IPC: C25D1/00 , B33Y10/00 , B33Y30/00 , B33Y50/02 , C25D5/04 , C25D5/10 , C25D21/12 , C25D17/12 , C25D15/00 , B33Y70/00 , C25D3/12 , C25D3/20 , C25D3/24 , C25D3/40 , C25D3/44 , C25D3/46 , C25D9/02 , C25D3/22 , C25D3/38
Abstract: An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data and for outputting a signal causing an anode array pattern; and, a controller. in communication with the addressing circuit and the anode array, configured to electrically control each anode in the anode array to cause an electrochemical reaction at the cathode that deposits a unitary layer structure according to the anode array pattern signal.
-
公开(公告)号：US10201092B2
公开(公告)日：2019-02-05
申请号：US15039464
申请日：2014-11-27
Applicant: JX Nippon Mining & Metals Corporation
Inventor： Tomota Nagaura
IPC: C25D5/48 , H05K3/20 , B32B15/01 , C25D1/04 , C25D7/06 , B32B15/20 , C25D5/14 , C25D3/40 , H05K1/09 , H05K3/00 , H05K3/02 , H05K3/40 , C25D3/16 , C25D3/38 , C25D3/58 , C25D9/08 , C25D5/04
Abstract: A carrier-attached copper foil having satisfactory circuit formability on the ultra-thin copper layer surface is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order. The ultra-thin copper layer surface has an absorbance of light at a wavelength of 400 nm is 85% or more.
-
4.发明申请公开(公告)号：US20170033372A1
公开(公告)日：2017-02-02
申请号：US15302825
申请日：2015-01-29
Applicant: JFE STEEL CORPORATION
Inventor： Takayoshi YANO , Shin ISHIKAWA
IPC: H01M8/021 , H01M8/0228 , H01M8/1004 , C25D5/36 , C25D5/12 , C25D3/40 , C25D3/46 , C25D3/48 , C25D3/60 , H01M8/026 , C25D3/12
CPC classification number: H01M8/021 , C23C28/02 , C25D3/12 , C25D3/40 , C25D3/46 , C25D3/48 , C25D3/60 , C25D5/12 , C25D5/36 , H01M8/0208 , H01M8/0228 , H01M8/026 , H01M8/1004 , H01M2008/1095 , H01M2250/20 , Y02T90/32
Abstract: The surface of a substrate made of stainless-steel foil is coated with a Sn alloy layer, with a strike layer in between. The coating ratio of the strike layer on the substrate is 2% to 70%.
Abstract translation: 由不锈钢箔制成的基板的表面涂覆有Sn合金层，其间具有击打层。 基板上的冲击层的涂布比例为2％至70％。
-
5.发明申请Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Method For Manufacturing The Printed Wiring Board 审中-公开载体铜箔，层压板，印刷线路板及制造印刷线路板的方法公开(公告)号：US20160353581A1
公开(公告)日：2016-12-01
申请号：US15039464
申请日：2014-11-27
Applicant: JX Nippon Mining & Metals Corporation
Inventor： Tomota Nagaura
IPC: H05K3/20 , B32B15/20 , C25D3/40 , H05K3/40 , H05K1/09 , H05K1/02 , H05K3/00 , H05K3/02 , B32B15/01 , C25D7/12
CPC classification number: H05K3/205 , B32B15/01 , B32B15/20 , B32B2307/306 , B32B2307/538 , B32B2457/08 , C25D1/04 , C25D3/16 , C25D3/38 , C25D3/40 , C25D3/58 , C25D5/04 , C25D5/14 , C25D5/48 , C25D7/0614 , C25D9/08 , H05K1/09 , H05K3/007 , H05K3/027 , H05K3/4038 , H05K2201/0338 , H05K2201/0355
Abstract: A carrier-attached copper foil having satisfactory circuit formability on the ultra-thin copper layer surface is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order. The ultra-thin copper layer surface has an absorbance of light at a wavelength of 400 nm is 85% or more.
Abstract translation: 提供了在超薄铜层表面上具有令人满意的电路成形性的载体附着铜箔。 载体附着铜箔依次具有载体，中间层和超薄铜层。 超薄铜层表面的波长为400nm的光的吸光度为85％以上。
-
Patent Agency Ranking
6.发明授权公开(公告)号：US09169576B2
公开(公告)日：2015-10-27
申请号：US13907433
申请日：2013-05-31
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Mutsuko Saito , Makoto Sakai , Yoko Mizuno , Toshiyuki Morinaga , Shinjiro Hayashi
Abstract: An electrolytic copper plating solution is provided which has an excellent via filling ability without using formaldehyde, which is harmful to the environment. An electrolytic copper plating solution which contains compounds which have an —X—S—Y— structure wherein X and Y are individually atoms selected from a group comprising hydrogen, carbon, sulfur, nitrogen, and oxygen atoms and X and Y can be the same only when they are carbon atoms and specific nitrogen-containing compounds. Good filled vias can be made without causing a worsening of the exterior appearance of the plating by using this electrolytic copper plating solution.
Abstract translation: 提供一种电解镀铜溶液，其具有优异的通孔填充能力，而不使用对环境有害的甲醛。 含有具有-X-S-Y-结构的化合物的电解铜电镀溶液，其中X和Y分别是选自氢，碳，硫，氮和氧原子的原子，X和Y可以相同 只有当它们是碳原子和特定的含氮化合物时。 可以通过使用该电解铜电镀溶液，而不会导致电镀外观恶化而形成良好的填充通孔。
-
公开(公告)号：US3216913A
公开(公告)日：1965-11-09
申请号：US38976664
申请日：1964-08-14
Applicant: ANTHONY DEBE
Inventor： ANTHONY DEBE
IPC: C25D3/40
CPC classification number: C25D3/40
-
公开(公告)号：US3168452A
公开(公告)日：1965-02-02
申请号：US12019961
申请日：1961-06-28
Applicant: ANTHONY DEBE
Inventor： ANTHONY DEBE
-
公开(公告)号：US3111465A
公开(公告)日：1963-11-19
申请号：US79182459
申请日：1959-02-09
Applicant: M & T CHEMICALS INC
Inventor： FRANK PASSAL
-
公开(公告)号：US2989448A
公开(公告)日：1961-06-20
申请号：US80488059
申请日：1959-04-08
Applicant: FRANCE DANIEL R
Inventor： FRANCE DANIEL R
-
-
-
-
-
-
-
-
-
Search Results
110
records
(took 0.018 seconds)
