Invention Grant US2732336A Electroplating composition for copper 失效 Basic information Please log in to see more content Basic information Please log in to see more content Electroplating composition for copper Patent Title: Electroplating composition for copper Application No.: US2732336D Application Date: Publication No.: US2732336A Publication Date: 1956-01-24 Main IPC: C25D3/40 IPC: C25D3/40 Information query Espacenet IPC分类: C 化学；冶金 C25 电解或电泳工艺；其所用设备 C25D 覆层的电解或电泳生产工艺方法；电铸（印刷电路的金属沉积法制造入H05K3/18）；工件的电解法接合；所用的装置（阳极或阴极保护入C23F13/00；单晶生长入C30B） C25D3/00 电镀；其所用的镀液 C25D3/02 .溶液（C25D5/24至C25D5/32优先） C25D3/38 ..铜的 C25D3/40 ...氰化物镀液
