Invention Grant
- Patent Title: Electrodeposition of copper
- Patent Title (中): 电沉积铜
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Application No.: US66676657Application Date: 1957-06-19
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Publication No.: US2873234APublication Date: 1959-02-10
- Inventor: FRANK PASSAL
- Applicant: METAL & THERMIT CORP
- Assignee: Metal & Thermit Corp
- Current Assignee: Metal & Thermit Corp
- Priority: US66676657 1957-06-19
- Main IPC: C25D3/40
- IPC: C25D3/40
Information query
