Invention Grant
- Patent Title: Electrodeposition of copper and copper alloys
- Patent Title (中): 铜和铜合金的电沉积
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Application No.: US66677357Application Date: 1957-06-19
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Publication No.: US2916423APublication Date: 1959-12-08
- Inventor: FRANK PASSAL
- Applicant: METAL & THERMIT CORP
- Assignee: Metal & Thermit Corp
- Current Assignee: Metal & Thermit Corp
- Priority: US66677357 1957-06-19
- Main IPC: C25D3/40
- IPC: C25D3/40 ; C25D3/58
Information query
