Invention Grant
- Patent Title: Electrodeposition of copper
- Patent Title (中): 电沉积铜
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Application No.: US10705761Application Date: 1961-05-02
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Publication No.: US3030282APublication Date: 1962-04-17
- Inventor: FRANK PASSAL
- Applicant: METAL & THERMIT CORP
- Assignee: Metal & Thermit Corp
- Current Assignee: Metal & Thermit Corp
- Priority: US10705761 1961-05-02
- Main IPC: B64D45/00
- IPC: B64D45/00 ; C25D3/40 ; F15B1/24
Public/Granted literature
- US20040139119A1 Feature/concept based local data service request formulation for client-server data services Public/Granted day:2004-07-15
Information query
