Invention Grant
- Patent Title: Plating bath containing formaldehyde producing material
- Patent Title (中): 含有甲醛生产材料的电镀浴
-
Application No.: US12020761Application Date: 1961-06-28
-
Publication No.: US3185637APublication Date: 1965-05-25
- Inventor: ANTHONY DEBE
- Applicant: ANTHONY DEBE
- Assignee: Debe Anthony
- Current Assignee: Debe Anthony
- Priority: US12020761 1961-06-28
- Main IPC: C25D3/24
- IPC: C25D3/24 ; C25D3/40 ; C25D3/58
Public/Granted literature
- US07655569B2 Method of manufacturing semiconductor device Public/Granted day:2010-02-02
Information query
