Invention Grant
- Patent Title: Copper plating bath
- Patent Title (中): 镀铜浴
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Application No.: US38976664Application Date: 1964-08-14
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Publication No.: US3216913APublication Date: 1965-11-09
- Inventor: ANTHONY DEBE
- Applicant: ANTHONY DEBE
- Assignee: Debe Anthony
- Current Assignee: Debe Anthony
- Priority: US38976664 1964-08-14
- Main IPC: C25D3/40
- IPC: C25D3/40
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