Invention Grant
- Patent Title: Chip bonding machine
- Patent Title (中): 贴片机
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Application No.: US57794466Application Date: 1966-09-08
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Publication No.: US3395845APublication Date: 1968-08-06
- Inventor: BEST HOWARD S , BORCHERT ALFRED E
- Applicant: CORNING GLASS WORKS
- Assignee: Corning Glass Works
- Current Assignee: Corning Glass Works
- Priority: US57794466 1966-09-08
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H03K17/70
Information query
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