Invention Grant
- Patent Title: Mounting circuit elements in printed circuit boards
- Patent Title (中): 印刷电路板安装电路元件
-
Application No.: US60295666Application Date: 1966-12-19
-
Publication No.: US3417294APublication Date: 1968-12-17
- Inventor: STEIDLITZ MARK
- Applicant: EMC TECHNOLOGY INC
- Assignee: Emc Technology Inc
- Current Assignee: Emc Technology Inc
- Priority: US60295666 1966-12-19
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18
Information query
