Invention Grant
US3419641A Hot melt adhesive comprising an aromatic-aldehyde resin and an ethylene-vinyl acetate copolymer 失效
包含芳族醛树脂和乙烯 - 乙酸乙烯酯共聚物的热熔粘合剂

Hot melt adhesive comprising an aromatic-aldehyde resin and an ethylene-vinyl acetate copolymer
Abstract:
1,185,226. Hot melt adhesive compositions. SUN OIL CO. 15 March, 1967 [18 March, 1966], No. 12145/67. Addition to 1,116,551. Headings C3P and C3R. A thermoplastic hot melt adhesive composition comprises a homogeneous mixture of 35 to 75 weight per cent of an aromatic hydrocarbonaldehyde resin free from acetate groups and having a ring and ball softening point of 70‹ to 150‹ C. and 25 to 65 weight per cent of an ethylene-vinyl acetate copolymer containing 17 to 42 weight per cent vinyl acetate. In an example there is described a resin obtained by reacting formaldehyde with a gas oil fraction containing aromatics, which is suitable for blending with copolymers of ethylene and vinyl acetate.
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