Invention Grant
US3419641A Hot melt adhesive comprising an aromatic-aldehyde resin and an ethylene-vinyl acetate copolymer
失效
包含芳族醛树脂和乙烯 - 乙酸乙烯酯共聚物的热熔粘合剂
- Patent Title: Hot melt adhesive comprising an aromatic-aldehyde resin and an ethylene-vinyl acetate copolymer
- Patent Title (中): 包含芳族醛树脂和乙烯 - 乙酸乙烯酯共聚物的热熔粘合剂
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Application No.: US53536666Application Date: 1966-03-18
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Publication No.: US3419641APublication Date: 1968-12-31
- Inventor: PETERKIN MELVIN E , HALL JR LEWIS W
- Applicant: SUN OIL CO
- Assignee: Sunoco Inc
- Current Assignee: Sunoco Inc
- Priority: US53536666 1966-03-18; US37235464 1964-06-03
- Main IPC: C08L61/18
- IPC: C08L61/18 ; C09J123/08 ; C09J131/04 ; C09J161/18
Abstract:
1,185,226. Hot melt adhesive compositions. SUN OIL CO. 15 March, 1967 [18 March, 1966], No. 12145/67. Addition to 1,116,551. Headings C3P and C3R. A thermoplastic hot melt adhesive composition comprises a homogeneous mixture of 35 to 75 weight per cent of an aromatic hydrocarbonaldehyde resin free from acetate groups and having a ring and ball softening point of 70‹ to 150‹ C. and 25 to 65 weight per cent of an ethylene-vinyl acetate copolymer containing 17 to 42 weight per cent vinyl acetate. In an example there is described a resin obtained by reacting formaldehyde with a gas oil fraction containing aromatics, which is suitable for blending with copolymers of ethylene and vinyl acetate.
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