Method and composition for the electrolytic etching of beryllium-copper alloys

Invention Grant

US3445355A Method and composition for the electrolytic etching of beryllium-copper alloys 失效

Title translation: 二乙酸铜合金电解蚀刻的方法和组合

Patent Title: Method and composition for the electrolytic etching of beryllium-copper alloys
Patent Title (中): 二乙酸铜合金电解蚀刻的方法和组合
Application No.: US3445355D

Application Date: 1966-07-15
Publication No.: US3445355A

Publication Date: 1969-05-20
Inventor: WOODBERRY PAUL T , KORETZKY HERMAN
Applicant: IBM
Assignee: Ibm
Current Assignee: Ibm
Priority: US56538666 1966-07-15
Main IPC: C25F3/02
IPC: C25F3/02 ; C23B3/02

Information query

Espacenet

IPC分类:

C	化学；冶金
C25	电解或电泳工艺；其所用设备
C25F	电解法除去物体上材料的方法；其所用的设备（借助电化学方法来处理水、废水或污水入C02F1/46；阳极或阴极保护入C23F13/00）
C25F3/00	电解浸蚀或抛光
C25F3/02	.浸蚀