发明授权
US3552002A Method of producing printed circuit boards 失效
生产印刷电路板的方法

Method of producing printed circuit boards
摘要:
A METHOD OF PRODUCING A PRINTED CIRCUIT BOARD BY WRAPPING ON A FIRST CYLINDER A RELATIVELY THIN, FLEXIBLE BLANK OF LAMINATED CIRCUIT BOARD MATERIAL HAVING A BACKING LAYER OF INSULATING MATERIAL AND A THIN SURFACE LAYER OF COPPER, WRAPPING ON A SECOND CYLINDER A SHEET OF COPY MATERIAL ILLUSTRATING A DESIRED DESIGN FOR A PRINTED CIRCUIT BOARD, ROTATING THE TWO CYLINDERS WHILE SCANNING THE COPY WITH A LIGHT-SENSITIVE SCANNER AND USING A SCANNERCONTROLLED CUTTER TO CUT AWAY AND REMOVE THE THIN COPPER SURFACE LAYER FROM THE LAMINATED BLANK CIRCUIT BOARD MATERIAL EXCEPT IN THE AREAS CORRESPONDING TO THE CIRCUIT DESIGN SHOWN ON THE COPY MATERIAL.
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