Large-scale integration of complex electronic circuitry and systems in semiconductor microminiature form comprising functional elements or cells at least partially in one surface of a semiconductor substrate and arranged in rows and columns with spaces between the rows, each cell including a plurality of first conductivity-type semiconductor regions in the substrate of opposite conductivity type in spaced-apart relation to form plural conduction paths and at least one semiconductor region of said first conductivity type extending under one of the spaces and being common to a conduction path in each of a pair of adjacent cells in a column. Also, disclosed is a multilayer connector pattern supported by the substrate and interconnecting the cells into an electronic system wherein the upper connector layer includes a supply line arranged to wind along the spaces in a serpentine fashion.