The difficulty in readily removing water from cured water-inthermosettable resin emulsions has been overcome by adding to the emulsion from about 0.005 to 10 parts per 100 parts of emulsion of a polyalkylene oxide block copolymer, nonionic surfactant wherein the hydrophobe portion of the nonionic surfactant has a molecular weight of at least about 1,000. Dewatering of the cured emulsion may be readily effected even at ambient temperatures and at elevated temperatures without cracking or damage to the porous thermoset resin.